Opsydia’s latest research
New work demonstrates a route to high-efficiency spatial division multiplexing connections without active alignment.
Opsydia has published new work outlining a practical path toward multicore fiber-to-chip interposers for spatial division multiplexing, cutting-edge technology expected to play an important role in meeting the bandwidth and power-efficiency demands of future data-center networks.
The paper, “Towards multicore fiber-to-chip interposers for spatial division multiplexing without active alignment,” presents glass interposers that can connect multicore fibers to photonic integrated circuits (PICs) while avoiding time-consuming and costly active-alignment steps normally required during assembly.
As artificial intelligence and cloud computing workloads continue to increase pressure on our data/telecom networks, the industry is looking beyond conventional single-core fiber links. Spatial division multiplexing allows more data channels to be carried through the physical distribution of light, and multicore fibers can place multiple optical cores inside a single strand to increase bandwidth density without expanding the physical footprint.
Authored by James Patchett, Polina Zavyalova, Eusebiu Sutu, Noel Moore and Patrick Salter of Opsydia Ltd., the paper was submitted for publication at SIGCOMM’s 1st Workshop on Memory, Systems and Interconnect Co-design for AI (MOSAIC '26) and positions active-alignment-free MCF-to-PIC coupling as an enabling technology for future high-capacity optical interconnects.
Read the full paper here.
About Opsydia
Opsydia develops and manufactures advanced laser processing systems for next-generation optical packaging and photonic integration.
Our machines combine proprietary laser technology, adaptive optics, and machine vision to create precision 3D optical waveguides directly inside transparent materials. This enables optical connections to be formed between photonic devices and optical fibres with unprecedented flexibility and accuracy, reducing packaging complexity and improving performance.
Today, Opsydia works with leading companies across the datacom, telecom, and quantum ecosystems to enable scalable, high-density optical interconnects for future generations of photonic systems.
