Opsydia team attends Global Advanced Manufacturing Alliance 2026
The Global Advanced Manufacturing Alliance was held on 2–3 June 2026 at the Warwick Grand Place Brussels Hotel.
The annual technical meeting brought together leaders across photonics, semiconductor manufacturing and advanced packaging to discuss how scalable, high-volume manufacturing can accelerate the commercial adoption of photonics technologies.
This year’s programme focused on the shift from specialised photonic solutions toward manufacturable, market-ready systems, with discussion spanning wafer-level integration, advanced packaging, co-packaged optics, sensing and photonics-enabled AI. For Opsydia’s Senior Scientist Dr James Patchett and VP of Business Development Jürgen Rieck, attending the event provided a valuable opportunity to hear directly from industry experts, exchange ideas with peers and gain insight into the manufacturing approaches shaping the next phase of photonics innovation.
Jürgen Rieck, VP Business Development, Opsydia said:
"My key takeaway from GAMA 2026 was that there is an enormous opportunity for our industry. The demand created by AI, datacom and future optical networks will require a new level of scalability across the entire ecosystem.
The race between technologies remains completely open, but discussions throughout the event repeatedly returned to the same themes: yield, automation, cost, standardisation and manufacturability.
Particularly interesting were discussions around glass-based architectures and panel-scale manufacturing, highlighting how closely photonics and semiconductor manufacturing are beginning to converge."
The next Global Advanced Manufacturing Alliance will be hosted by ASML on 12-13 May 2027.
About Opsydia
Opsydia develops and manufactures advanced laser processing systems for next-generation optical packaging and photonic integration.
Our machines combine proprietary laser technology, adaptive optics, and machine vision to create precision 3D optical waveguides directly inside transparent materials. This enables optical connections to be formed between photonic devices and optical fibres with unprecedented flexibility and accuracy, reducing packaging complexity and improving performance.
Today, Opsydia works with leading companies across the datacom, telecom, and quantum ecosystems to enable scalable, high-density optical interconnects for future generations of photonic systems. Learn more about Opsydia.
